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systeMECH Develops New Manufacturing Approach for Flexible Hybrid Electronics

Direct die placement is seen as a viable alternative to the pick and place method.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

Flexible hybrid electronics are increasingly seen as an ideal means to bring together flexible, printed and traditional electronics. One key aspect is developing the manufacturing techniques that will merge these approaches together. Pick and place is a common means of production, but there are limitations.   systeMECH, Inc. believes it has an alternative production method. Developed by Dr. David Grierson and Prof. Kevin Turner at the University of Wisconsin-Madison, systeMECH was launched in 20...

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